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Material background
Graphs and Analysis

     

 Coating thickness measurement, photographed with a 500X MTF-300 microscope    Coating thickness measurement, photographed with a 500X MTF-300 microscope

    *The above pictures may not be reproduced without permission, otherwise legal liability will be pursued.

 

Solution

    Mounting:

     

                       MC002 Extremely fast, hard and clear cold mounting kit                                                       The sample after mounting

    Grinding & Polishing:

The step of

grinding & polishing

Coarse Grinding

Fine Grinding

Diamond Coarse Polishing

Diamond

Fine Polishing

Diamond Final Polishing

/oxide polishing

1

Surface

SiC

sandpaper

SiC

sandpaper

PCY

Wool fabric

PCV red

short velvet

PCX Neoprene

2

Abrasive Granularity

400#

800#1200#4000#

3μm

1μm

0.05μm

3

Polishing/

Lubricant

water

water

DS001 High perfomance polycrystalline
diamond suspension

DS001 High perfomance polycrystalline
diamond suspension

OS001-JP

aluminum oxide polishing liquid

4

Pressure

30N

25N

25N

20N

15N

5

Rotation Speed

300

300

150

150

150

6

Time/min.

1

2

3~5

2~3

2~5


The above recommended parameters are taken from: Preparation method of copper and copper alloy samples with a diameter of 30 mm and a diameter of 250 mm on the automatic grinding and polishing machine Smoothneer-6.

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Customized service is provided for your material and demands

Truer has experience engineers in technology service and experts who has abundant sample preparation skills and can provide the customized service to you.We will provide the professional preparation skill and operating proposals also can install and debug on-site.Warranty is one year for the equipment and lifetime maintenance.The technical support online and skills training can be provided annual.

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