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Key points in sample preparation:

Compared with other metals, titanium has a relatively low thermal conductivity, so water cooling must be used when cutting the sample to prevent local overheating. In addition, the cutting rate and feed rate of the cutting blade should be reduced. Materials are divided into soft and hard. In addition to silicon carbide cutting blades, resin diamond cutting blades with relatively weak bonding strength can also be used for cutting.

     

                                          Hard mold cold mounting                                                                                   Sample after mounting

 

     

                                        Chip capacitor 0402 7R 100X                                                                          Chip capacitor 0402 COG 100X

 

     

                                      Chip capacitor 0603 7R 50X                                                                                 Chip capacitor 0603 7R 100X

 

     

                                          Chip capacitor 0603 COG 50X                                                                             Chip capacitor 0805 COG 50X

   

 

Solution

In view of the small size of chip capacitors, it is difficult to grasp the specific observation surface and it is easy to over-grind. We used the quantitative grinding function of Smoothneer-6, which can accurately control the grinding removal amount of the sample by 50µm~5000µm.

     

     Smoothneer-6 Metallographic Automatic Grinding and Polishing Machine                                    Grinding Amount Control Interface

    The following is the sample preparation method::

    Mounting:

     

                          MC003 Vacuum-free Clear Cold Mounting Kit                                                               The samples after mounting

    Grinding & Polishing:

The step of

grinding & polishing

Coarse Grinding

Fine Grinding

Diamond Coarse Polishing

Diamond Fine

Polishing

Diamond Final Polishing

/oxide polishing

1

Surface

SiC

sandpaper

SiC

sandpaper

PCY Wool fabric

PCV red

short velvet

PCX Neoprene

2

Abrasive Granularity

400#

800#1200#4000#

3μm

1μm

0.05μm

3

Polishing/

Lubricant

water

water

DS001 High performance polycrystalline diamond suspension

DS001 High performance polycrystalline diamond suspension

OS001-JP fine polishing liquid mu0.05
alumina

4

Pressure

30N

25N

25N

20N

15N

5

Rotation Speed

300

300

150

150

150

6

Time/min.

1

2

3~5

2~3

2~5

The above recommended parameters are taken from: Preparation method of Ø30 mm copper and copper alloy samples with Ø250 mm working plate on automatic grinding and polishing machine Smoothneer-6.

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Truer has experience engineers in technology service and experts who has abundant sample preparation skills and can provide the customized service to you.We will provide the professional preparation skill and operating proposals also can install and debug on-site.Warranty is one year for the equipment and lifetime maintenance.The technical support online and skills training can be provided annual.

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